It is used to remove impurities on the surface of silicon wafer, form pyramid suede on the surface of silicon wafer and reduce the reflectivity of silicon wafer surface.
Equipment performance
Capacity: up to 8000 Wafers / hour
Effective utilization rate of equipment: ≥ 97%
Fragment rate: M12 ≤ 0.01%
Silicon wafer specification
Silicon wafer thickness: ≥ 160 μ m
Silicon wafer size: 182 * 182-230 * 230mm
Flower basket type: low surface carrier (LSC) made by PVDF
Space between flower baskets: 4.76mm
Basket capacity: 100 wafers
Manipulator system
Manipulator: 8 sets
Servo motor: 16 PC
Lift time: less than 22 sec
Equipment size
Length * width * height: 27300 * 3200 * 2650mm
direction
Working direction:Left→Right / Right→Left(TBD)
power supply
Power supply: AC380V 3Ph + PE + n 50Hz (TBD)
Control power supply: DC 24V
Full load power supply: 230kw / 175kW
Recommended maximum fuse size: 225A / 135a
Installation requirements
Minimum ground bearing capacity: 750KG / ㎡
Minimum workshop height: 3.5m
Clean room level: iso7 (10K class)
Ambient temperature: 17 ℃< RT < 30 ℃
Maximum humidity: 70%