It is used for removing the damaged layer of monocrystalline silicon wafer, flocking, cleaning and drying.
Equipment performance
Capacity: up to 9600 / 8000 / 10000 / 12000 Wafers / hour
Effective utilization rate of equipment: ≥ 98%
Fragment rate: ≤ 0.01%
Silicon wafer specification
Silicon wafer thickness: ≥ 140 μ m
Silicon wafer size: 156.75 * 156.75mm-212 * 212mm
Flower basket type: low surface carrier (LSC) made by PVDF
Space between flower baskets: 4.1mm
Basket capacity: 100-120 wafers
Manipulator system
Manipulator: 4 sets
Servo motor: 8 PC
Lift time: less than 5 sec
Equipment size
Length * width * height: 15998 * 2630 * 2574mm
Length * width * height: 16200 * 3000 * 2574mm
Length * width * height: 17730 * 3000 * 2574mm
Length * width * height: 25560 * 2960 * 2574mm
direction
Working direction:Left→Right / Right→Left(TBD)
power supply
Power supply: AC380V 3Ph + PE + n 50Hz (TBD)
Control power supply: DC 24V
Full load power supply: 230kw / 138kw
Recommended maximum fuse size: 225A / 135a
Installation requirements
Minimum ground bearing capacity: 750KG / ㎡
Minimum workshop height: 3.5m
Clean room level: iso7 (10K class)
Ambient temperature: 17 ℃< RT < 30 ℃
Maximum humidity: 70%