Equipment performance
Adjustable transmission speed: 0.5-3m/min
Normal operation speed: 2.5m/min
Capacity: up to 4000 / 6800 / 8000 wafers/ H@20mm
Effective utilization rate of equipment: ≥ 98%
Reflectivity: ≤ 16%
Fragment rate: ≤ 0.03%
Silicon wafer specification
Silicon wafer thickness: ≥ 140 μ m
Silicon wafer size: 156.75 * 156.75mm-212 * 212mm
Equipment size
Length * width * height: 5060 * 2250 * 2120mm
Length * width * height: 3710 * 2650 * 2120mm
Length * width * height: 3810 * 3050 * 2200mm
Working width: 965mm / 1515mm / 1911mm
Transmission height: 1000 ± 25mm
Module material: PP, PVDF
transmission
Transmission type: 5 lane / 8 Lane / 10 Lane
Shaft spacing: 50mm / 60mm
Main drive shaft: 17mm, hexagon
Drive roller: Φ 32mm
direction
Working direction:Left→Right / Right→Left(TBD)
power supply
Power supply: AC380V 3Ph + PE + n 50Hz (TBD)
Control power supply: DC 24V
Full load power supply: 25A / 48A
Recommended maximum fuse size: 48A / 63A
Installation requirements
Minimum ground bearing capacity: 750KG / ㎡
Minimum workshop height: 3.5m
Clean room level: iso7 (10K class)
Ambient temperature: 17 ℃< RT < 30 ℃
Maximum humidity: 70%